Solving surface scoring with proprietary bore polishing. A high-end electronic wire manufacturer reduced defect rates from 2% to 0.3%.
A manufacturer of silver-plated copper wire for high-frequency data transmission faced high rejection rates (approx. 2%) due to longitudinal surface scoring. Manual polishing of the dies resulted in inconsistent bearing surfaces, creating microscopic peaks that scratched the delicate silver plating.
We implemented our proprietary multi-stage ultrasonic bore polishing process. Unlike manual methods, this automated technique achieves a surface roughness of Ra < 0.05μm consistently across every die. We also optimized the reduction angle to facilitate smoother material flow.
Fig 1. Analysis and Implementation
The defect rate dropped from 2% to 0.3% within two weeks of implementation. The mirror-finish dies also generated less friction heat, better preserving the integrity of the silver plating and reducing lubricant breakdown.
Our application engineers can audit your current setup and propose a similar high-performance tooling solution.