Using high-thermal-conductivity substrates to maintain stability and low vibration despite a 50% speed increase in automotive wire production.
An automotive wire supplier wanted to increase line speed from 20m/s to 30m/s to meet demand. However, at higher speeds, vibration and heat caused the wire to become oval ('chatter marks') and the dies to fail prematurely.
We utilized a specialized Tungsten Carbide grade with superior thermal conductivity and engineered a vibration-damping steel casing. We also optimized the die approach angle to reduce drawing force at high velocities.
Fig 1. Analysis and Implementation
The client successfully ramped up to 32m/s while maintaining CPK > 1.33. Die life remained consistent with previous lower-speed operations thanks to efficient heat dissipation.
Our application engineers can audit your current setup and propose a similar high-performance tooling solution.